Hong Kong government proposes raising bond programme borrowing ceiling from HK$700 billion to HK$900 billion for infrastructure projects
In a significant move to bolster infrastructure development, the Hong Kong government has proposed raising its borrowing ceiling for bond programmes from HK$700 billion to HK$900 billion (approximately US$115 billion). This proposal was announced by Andrew Lai Chi-wah, the permanent secretary for financial services and the treasury, during a Legislative Council subcommittee meeting on Thursday. Officials have stated that the increased borrowing cap would sufficiently cover funding for infrastructure projects over the next three years. Lai reassured lawmakers, including Robert Lee Wai-Wang, about the adequacy of the new limit to support projects unless "significant and unforeseen events" arise. The proposal... [Continue Reading]
360LiveNews | 09 Apr 2026 15:55
